銅張積層板及びそれを用いた多層板。

Copper clad laminated sheet and multilayered board using it

Abstract

【課題】 繊維布基材の銅張積層板と比較し、積層時の成形厚みのバラツキ、熱的・機械的な耐衝撃性、Z方向の耐マイグレーション性などに優れ フレキシブル銅張積層板と比較し、弾性率などの機械強度が高い銅張積層板、及び多層板の提供。 【解決手段】 中間層に少なくとも1枚の耐熱フィルム基材Bステージ樹脂組成物シート、最外層に少なくとも1枚の無機及び/又は有機繊維基材プリプレグを使用した複合基材積層板の少なくとも片面に銅層を有する銅張積層板、並びに該銅張積層板を使用し、ビルドアップ層、及び/又はボンディング層に、上記耐熱フィルム基材Bステージ樹脂組成物シートを使用した多層板。 【効果】 積層時の成形厚みのバラツキ、熱的・機械的な耐衝撃性、Z方向の耐マイグレーション性などに優れた銅張積層板、及び多層板が得られた。
<P>PROBLEM TO BE SOLVED: To provide a copper clad laminated sheet excellent in the irregularity resistance of a molding thickness at the time of lamination, thermal and mechanical impact resistance and migration resistance in a Z-direction as compared with a copper clad laminated sheet of a fiber cloth base material and enhanced in mechanical strength such as elastic modulus or the like as compared with a flexible copper clad laminated sheet, and a multilayered board using it. <P>SOLUTION: The copper clad laminated sheet is constituted by providing a copper layer at least on one side of a composite base material laminated sheet wherein at least one heat-resistant film base material B-stage resin composition sheet is used in an intermediate layer and at least one inorganic and/or organic fiber base material prepreg is used in the outermost layer. In the multilayered board using the copper clad laminated sheet, the heat-resistant film base material B-stage resin composition sheet is used in a build-up layer and/or a bonding layer. By this constitution, both of the copper clad laminated sheet and the multilayered board are excellent in the irregularity resistance of a molding thickness at the time of lamination, thermal and mechanical impact resistance and migration resistance in a Z-direction. <P>COPYRIGHT: (C)2005,JPO&NCIPI

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